1、 表面间连接：interlayer connection
2、 层间连接：interlayer connection
3、 内层连接：innerlayer connection
4、 非功能表面连接：nonfunctional interfacial connection
5、 跨接线：jumper wire
6、 节（交）点：node
7、 附加线：haywire
8、 端接（点）：terminal
9、 连接线：terminated line
10、 端接：termination
11、 连接端：pad, land
12、 贯穿连接：through connection
13、 支线：stub
14、 印制插头：tab
15、 键槽：keying slot
16、 连接器：connector
17、 板边连接器：edge board connector
18、 连接器区：connector area
19、 直角板边连接器：right angle edge connector
20、 偏槽口：polarizing slot
21、 偏置端接区：offset terminal area
流程简介：开料－－钻孔－－干膜制程－－压合－－减铜－－电镀－－塞孔－－防焊(绿漆/绿油)
－－镀金－－喷锡－－成型－－开短路测试－－终检－－雷射钻孔
A. 开料( Cut Lamination)
a-1 裁板( Sheets Cutting)
a-2 原物料发料(Panel)(Shear material to Size)
B. 钻孔(Drilling)
b-1 内钻(Inner Layer Drilling )
b-2 一次孔(Outer Layer Drilling )
b-3 二次孔(2nd Drilling)
b-4 雷射钻孔(Laser Drilling )(Laser Ablation )
b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling)
C. 干膜制程( Photo Process(D/F))
c-1 前处理(Pretreatment)
c-2 压膜(Dry Film Lamination)
c-3 曝光(Exposure)
c-4 显影(Developing)
c-5 蚀铜(Etching)
c-6 去膜(Stripping)
c-7 初检( Touch-up)
c-8 化学前处理,化学研磨( Chemical Milling )
c-9 选择性浸金压膜(Selective Gold Dry Film Lamination)
c-10 显影(Developing )
c-11 去膜(Stripping )
Developing , Etching & Stripping ( DES )
D. 压合Lamination
d-1 黑化(Black Oxide Treatment)
d-2 微蚀(Microetching)
d-3 铆钉组合(eyelet )
d-4 叠板(Lay up)
d-5 压合(Lamination)
d-6 后处理(Post Treatment)
d-7 黑氧化( Black Oxide Removal )
d-8 铣靶(spot face)
d-9 去溢胶(resin flush removal)
E. 减铜(Copper Reduction)
e-1 薄化铜(Copper Reduction)
F. 电镀(Horizontal Electrolytic Plating)
f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating)
f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)
f-3 低于1 mil ( Less than 1 mil Thickness )
f-4 高于1 mil ( More than 1 mil Thickness)
f-5 砂带研磨(Belt Sanding)
f-6 剥锡铅( Tin-Lead Stripping)
f-7 微切片( Microsection)
G. 塞孔(Plug Hole)
g-1 印刷( Ink Print )
g-2 预烤(Precure)
g-3 表面刷磨(Scrub)
g-4 后烘烤(Postcure)
H. 防焊(绿漆/绿油): (Solder Mask)
h-1 C面印刷(Printing Top Side)
h-2 S面印刷(Printing Bottom Side)
h-3 静电喷涂(Spray Coating)
h-4 前处理(Pretreatment)
h-5 预烤(Precure)
h-6 曝光(Exposure)
h-7 显影(Develop)
h-8 后烘烤(Postcure)
h-9 UV烘烤(UV Cure)
h-10 文字印刷( Printing of Legend )
h-11 喷砂( Pumice)(Wet Blasting)
h-12 印可剥离防焊(Peelable Solder Mask)
I . 镀金Gold plating
i-1 金手指镀镍金( Gold Finger )
i-2 电镀软金(Soft Ni/Au Plating)
i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au)
J. 喷锡(Hot Air Solder Leveling)
j-1 水平喷锡(Horizontal Hot Air Solder Leveling)
j-2 垂直喷锡( Vertical Hot Air Solder Leveling)
j-3 超级焊锡(Super Solder )
j-4. 印焊锡突点(Solder Bump)
K. 成型(Profile)(Form)
k-1 捞型(N/C Routing ) (Milling)
k-2 模具冲(Punch)
k-3 板面清洗烘烤(Cleaning & Backing)
k-4 V型槽( V-Cut)(V-Scoring)
k-5 金手指斜边( Beveling of G/F)
L. 开短路测试(Electrical Testing) (Continuity & Insulation Testing)
l-1 AOI 光学检查( AOI Inspection)
l-2 VRS 目检(Verified & Repaired)
l-3 泛用型治具测试(Universal Tester)
l-4 专用治具测试(Dedicated Tester)
l-5 飞针测试(Flying Probe)
M. 终检( Final Visual Inspection)
m-1 压板翘( Warpage Remove)
m-2 X-OUT 印刷(X-Out Marking)
m-3 包装及出货(Packing & shipping)
m-4 目检( Visual Inspection)
m-5 清洗及烘烤( Final Clean & Baking)
m-6 护铜剂(ENTEK Cu-106A)(OSP)
m-7 离子残余量测试(Ionic Contamination Test )(Cleanliness Test)
m-8 冷热冲击试验(Thermal cycling Testing)
m-9 焊锡性试验( Solderability Testing )
N. 雷射钻孔(Laser Ablation)
N-1 雷射钻Tooling孔(Laser ablation Tooling Hole)
N-2 雷射曝光对位孔(Laser Ablation Registration Hole)
N-3 雷射Mask制作(Laser Mask)
N-4 雷射钻孔(Laser Ablation)
N-5 AOI 检查及VRS ( AOI Inspection & Verified & Repaired)
N-6 Blaser AOI (after Desmear and Microetching)
N-7 除胶渣(Desmear)
N-8 微蚀(Microetching )
